Ansys Inc has announced the latest release of Ansys Icepak software, which applies fluid-dynamics technology to electronics thermal management. The 12.0 release introduces new features for PCB ...
Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...
PITTSBURGH, Oct. 19, 2023-- Ansys (NASDAQ: ANSS) multiphysics solutions have been certified by global semiconductor foundry UMC to simulate its latest 3D-IC WoW stacked technology, which will improve ...
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