V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.
The incessant demand for more speed in chips requires forcing more energy through ever-smaller devices, increasing current density and threatening long-term chip reliability. While this problem is ...
The downsizing trend of devices gives rise to continuous demands of increasing input/output (I/O) and circuit density, and these needs encourage the development of a High-Density Fan-Out (HDFO) ...
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