3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
The concepts of 3D-IC and chiplets have the whole industry excited. It potentially marks the next stage in the evolution of the IP industry, but so far, technical difficulties and cost have curtailed ...
In recent years, a wave of consolidation has swept through the global IC trading sector, with companies seeking to stand out in a fiercely competitive market by engaging in mergers and acquisitions.
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