Don't be so stuck in the circuits that you forget the importance of IC packages. Here are a couple cards from the Microchip 2005 product selector: While most design engineers are using surface mount ...

Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...

The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. Applied Materials recently rolled out an ECD system for IC ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

A cornerstone of effective STCO is the ability to conduct multi-domain analyses—for example, signal integrity, power ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

When it comes to making though-silicon vias, there are no clear lines of delineation about the roles of design houses, fab facilities, and packaging houses. Yet all of these entities face a host of ...

Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have ...

NeoGene Tech, a Guangzhou-based Taiwanese thermal management solution provider, has in Q3 2022 supported Xiaomi to successfully launch its flagship 5G smartphone, Xiaomi 12S Ultra, with excellent ...

Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center ...