Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...

A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems ...

South Korea has unveiled a support package to strengthen its semiconductor industry and catch up with international rivals. The plan aims to support large companies and weaker sectors, particularly in ...

Kaynes SemiCon, a fully owned subsidiary of Kaynes Technology India, has emphasized the value of legacy semiconductor packages in driving the country's manufacturing goals. In a recent interview with ...

TL;DR: Intel CEO Pat Gelsinger stated that the use of on-package memory with Lunar Lake CPUs was a one-time decision due to its impact on gross margins. Future CPUs, including Panther Lake and Nova ...

The relentless pursuit of performance in sectors such as AI, cloud computing, and autonomous driving is creating a heat crisis. As the next generation of processors demand more power in smaller spaces ...

Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...