Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...
RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.
NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...
The QPF5001 X-band FEM incorporates a power amplifier, low-noise amplifier (LNA), and limiter. Half the size of a discrete component implementation, the MCM targets the 8- to 12-GHz X-Band. The ...
Energy/bit optimization approach for multi-chip systems with possibility of co-optimization with the routing resources defined by the signalling pitch. December 7th, 2022 - By: Fraunhofer IIS/EAS More ...
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
In a significant leap for India’s semiconductor ambitions, the country’s first commercially packaged multi-chip module (MCM) rolled out early Wednesday from Kaynes Semicon’s outsourced semiconductor ...
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