TE’s new Sliver straddle-mount connectors to be useful for OCP NIC 3.0 cards in a low profile for ease of system maintenance and improved thermal management. TE Connectivity (TE) recently introduced ...
TE Connectivity (TE) announced today a plan to create a standard for a new 100-Gb/s form factor pluggable interconnect with the functionality of QSFP28 in a thermally enhanced package approximately ...
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