Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...
Uncover the unique challenges, along with the latest Calibre verification solutions, for 3D-IC design in this new technical paper. As 2.5D and 3D-ICs redefine the possibilities of semiconductor design ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
What's the point of having the hottest high-performance chip available when it doesn't fit on the board? We've all heard horror stories about chips not meeting timing closure or not working when ...
The strengths of Taiwan's IC design sector include excellent and dedicated STEM talent, a complete semiconductor industry ecosystem from upstream to downstream, and a well-developed downstream ICT ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
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