Copper’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of copper (Cu) ...
A logarithmic spiral with a diameter of 500 μm, approximately half the diameter of a sewing needle. Curiosity about a mistake that left tiny dots on a germanium wafer with evaporated metal films led ...
What is Reactive Ion Etching (RIE)? Reactive Ion Etching (RIE) is a dry etching technique widely used in the fabrication of micro- and nanodevices. It combines the chemical reactivity of reactive ...
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