Partially defective, marginal die can still be functional enough to pass final electrical test. Some of these “walking wounded” chips get past final testing, but in the customer’s end product, under ...

Detecting macro-defects early in the wafer processing flow is vital for yield and process improvement, and it is driving innovations in both inspection techniques and wafer test map analysis. At the ...

I’ve had a fairly varied early part of my career in the semiconductors business: a series of events caused me to jump disciplines a little bit, and after one such event, I landed in the test ...

Microelectronic device manufacturers can use the IRIS wafer-inspectionsystem from SemiProbe to detect flaws in the wafer circuit pattern, aswell as contamination or process damage. Depending on the ...