A team led by researchers at Rensselaer Polytechnic Institute (RPI) has made a breakthrough in semiconductor development that ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

Nippon Electric Glass Co. has embarked on developing an innovative glass core substrate compatible with CO2 laser processing, aiming to enhance the efficiency of manufacturing next-generation ...

US startup Substrate has developed a chipmaking tool that it claims can compete with ASML's advanced lithography equipment, aiming to significantly reduce chip manufacturing costs.

Philoptics said on the 29th that it was selected as a top materials, parts, and equipment (MPE) corporation overseen by the Ministry of Trade, Industry and Energy. The MPE top corporations program ...

Samsung Electro-Mechanics is partnering with Japan's Sumitomo Chemical Group to commercialize 'glass core' technology. Amid ...

Substrate sets sights on TSMC Notably, Substrate’s ultimate goal is not just to replace ASML, but to challenge TSMC, the world’s largest foundry. According to Reuters, Proud said the company’s tool ...

TOKYO and SEOUL, South Korea, Nov. 5, 2025 /PRNewswire/ -- Samsung Electro-Mechanics announced on the 5th that it has signed ...

Why it matters: Many believe that glass substrate technology will enable the industry to sustain Moore's Law beyond 2030, ensuring continuous development without being constrained by process size ...

Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential withdrawal amid ...