IC design has become easier with the great tools from Cadence, Mentor Graphics, Synopsis and other tools. Package design is still wickedly complex and getting harder with smaller packages, and the ...

EPEPS -- Cadence Design Systems, Inc. , a leader in global electronic design innovation, today announced enhancements to its Allegro® 16.6 Package Designer and System-in-Package Layout solution ...

Targeting a silicon device for a flip-chip package introduces significant IC and package design complexities throughout the entire product development ...

Package Design: the Art of Selling, All Wrapped Up When competition for customers’ attention gets ferocious, that bottle, carton or can is a lot more than just another pretty face ...

SoC package design takes 'bottom-up' tack - March 15, 2005 ...

A High-Level ‘How To’ Guide For Effective Chip-Package Thermal Co-Design Seven important steps you need to build into your current and future flows deal with heat.

Fairchild Capital Partners has acquired Buffalo, New York-based Package Design & Supply Co., Inc, a maker of industrial and business packaging and shipping products and supplies.