Along with showing excellent electrical conductivity, the printed fabrics continued to perform well after 20 cycles of ...

As AI chips get larger, it becomes much harder to test them. Today, there can be as many as 22,000 pins on a 150mm² die, but in the future that number may increase to 80,000 pins. That creates a huge ...

Circuits are being pushed harder and longer, particularly with AI, speeding up the aging of data paths. Photonics adds its ...

Experts at the Table: Semiconductor Engineering sat down to discuss the causes of chip failures, how to respond to them, and how that can change over time, with Steve Pateras, vice president of ...

A new technical paper titled “Coherent EUV scatterometry of 2D periodic structure profiles with mathematically optimal ...

A new technical paper titled “Customizing a Large Language Model for VHDL Design of High-Performance Microprocessors” was ...

Two standards — Bunch of Wires (BoW) and UCIe — compete with proprietary designs. Today, the latter predominates, since ...

Chip smuggling prevention; AI export controls and deals; OSAT revenue up; AI PC memory chipsets; big fundings and buybacks; ...

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has ...

Chiplets will be a key enabler for customizing designs at every level, from edge devices to the cloud. AI is a key driver, ...

Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.

Exploiting CPU Cache Side-Channels to Leak Tokens from Large Language Models” was published by researchers at MITRE and Worcester Polytechnic Institute. Abstract “Side-channel attacks on shared ...