Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today’s energy-conscious computing environment.

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.