Abstract: This paper presents the study on the performance of High-Density Polyethylene (HDPE) as cable insulating materials containing manufacturing defects. In the present work, the effects of voids ...
Learn how modelling boosts innovation in transport R&D, from fuel cells to rocket systems, in this free ebook.
Accountancy firm Grant Thornton has taken a lease on tech company Raspberry Pi’s vacated first floor offices at the Maurice ...
COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...
The MarketWatch News Department was not involved in the creation of this content. BURLINGTON, Mass., Nov. 18, 2025 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, ...
The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...
Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...
At the 2025 COMSOL Conference Boston, engineers saw simulations of low-frequency electromagnetics and how circuits generate heat. Boston — COMSOL, a company that produces multiphysics simulation ...
All-solid-state battery configuration with the abstract model. Various surface coating strategies are investigated by the proposed multiphysics model in terms of electrochemical-mechanical coupled ...
3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...
The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...