MB85RSXX is a FeRAM (Ferroelectric Random Access Memory) chip, using the ferroelectric process and silicon gate CMOS process technologies for forming the nonvolatile memory cells. MB85RSXX adopts the ...
Abstract: We demonstrate the high scalability of equivalent oxide thickness (EOT) scaled HfO2-ZrO2-HfO2 (HZH) gate stacks based on FinFETs with a physical gate length (Lg) of 25 nm. Benefiting from ...
Abstract: For the first time, we present a one-transistor dynamic random access memory (DRAM) cell using the ferroelectric polarization-assisted charge trapping phenomenon. The gate structure is ...
A new technical paper titled “Nitride Ferroelectric Domain Wall Memory for Next-Generation Computing” was published by researchers at Kiel University, Fraunhofer Institute for Silicon Technology (ISIT ...
Researchers in Japan have developed ultrathin ferroelectric capacitors that maintain strong polarization at a stack thickness of just 30 nm, including top and bottom electrodes. Using scandium-doped ...