University of Houston engineers have developed a potentially transformative thin-film dielectric material that enhances AI ...
Abstract: Multi-chip power µModules (micromodule) are widely used in modern electronics systems. Due to high power consumption of µModules, a good packaging design is critical to meet thermal ...
Abstract: With the trend of miniaturization of electronic products, the integration of passive devices has become a feasible way to save space. In the field of electronic packaging, the concept of ...
NEW YORK, Jan 13 (Reuters) - The U.S. government said on Monday it would further restrict artificial intelligence chip and technology exports, divvying up the world to keep advanced computing power in ...
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