SEC-TPM™ Accelerates CRA Compliance with Embedded TPM for STM32 MPUs without Hardware Redesign STMicroelectronics NV ...

Vikram Solar Ltd today announced the adoption of G12R format across its entire PV module portfolio. The company said the move ...

Apple is anticipated to unveil its first foldable device, the iPhone Fold, alongside the iPhone 18 Pro and Pro Max this ...

Apple's foldable iPhone will share the same next-generation A20 Pro chip as the iPhone 18 Pro and iPhone 18 Pro Max models ...

Honor Magic 8 RSR is confirmed with a Snapdragon 8 Elite Gen 5 chip and 24GB RAM, revealed ahead of launch as a rare flagship configuration.

The "distributed shipbuilding" concept should reduce the time it takes to build the frigates, according to the Chief of Naval ...

V SiC power modules includes a 608-A half-bridge module with 2.4-mΩ on-resistance and best-in-class thermal resistance.

Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 ...

South Korean firm will invest in an advanced packaging plant in Cheongju to expand HBM supply as AI demand tightens memory.

Delicate features, uneven surfaces, and extreme density make it difficult to manage probe force and ensure reliability.

"This FCC authorization is a game-changer for enabling next-generation services," FCC Chair Brendan Carr said in a statement ...

Electronic System Design (ESD) industry revenue increased 8.8% to $5,566.4 million in the third quarter of 2025 from the $5,114.5 million registered in the third quarter of 2024, the ESD Alliance, a ...