IC ecosystem; UPF 4.0; AI readiness; auto, industrial chiplet SW; PCIe 6; 3D thermal analysis; rad-hard simulation.

Controlling film thickness to precise specifications is essential for ensuring high yield in high-performance devices.

The AI Readiness Index Report provides a valuable benchmark against which organizations can measure their AI maturity. For ...

Boot-up and software deployment in distributed, synchronized multi-processor systems that integrate additional accelerators.

With each iteration, PCIe has not only increased data bandwidth but also introduced innovations aimed at enhancing power efficiency—a critical factor in today’s energy-conscious computing environment.

Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on ...

Activation functions play a critical role in AI inference, helping to ferret out nonlinear behaviors in AI models. This makes ...

The impact of embedded micro-bumps and wafer-to-wafer hybrid bonding on the thermal behavior of the package stack.

Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based ...

The automotive industry is deep in the throes of a massive shift to software-defined vehicle architectures, a multi-year effort that will change the way automotive chips are designed, where they are ...

Key applications for GenAI and the features they enable, as well as an examination of how model growth and differing model ...

Create a hybrid digital twin with data and physics.